Chip Shooter Model: 4 - Sony F130s Board size: 50mm X 50mm to 460mm X 360mm PWB thickness 0.5mm to 2.6mm Precision: 50 µ m(Cpk 1.0 or greater Components Size: 0402 - 12mm square (movable camera) 6mm max height Head: 12 nozzles/1head Controls: Front:Color LCD touch panel display and console Rear: console Speed: 0.139sec (25,9000CPH) (movable camera) Capacity: 40 front cassettes + 40 rear cassettes (80 total) Vision system: Reflective imaging/transmissive imaging (may be used concurrently) Sony F130 Specification Link   Fine Pitch Placer Model: 2 - Sony F209s Board size: 50mm X 50mm to 460mm X 360mm PWB thickness 0.5mm to 2.6mm Precision: 60µ m (Cpk 1.0 or greater) (chip) 50µ m (Cpk 1.0 or greater)(VQFP 208 pins) Components Size: See specifications page with link below Head: 6 nozzles/1head Controls: Front:Color LCD touch panel display and console Rear: console Speed: 0.49sec (7,350 CPH) (movable camera) 1.4 sec (2,500 CPH) (fixed camera) Capacity: 40 front cassettes + 40 rear cassettes (80 total) Vision system: Reflective imaging/transmissive imaging (may be used concurrently) Sony F209 Specification Link   Glue Dispenser Model: Fuji GL II Board size: 450mm x 350mm Accuracy: 0.1mm Speed: 20000 dots per hour Capacity:2 syringes, paste or epoxy   ROHS Certified Lead Free Reflow Oven Model:Conceptronic HVA 102 Board size: Up to 508mm Zones: 14 Closed loop heating zones, 7 top, 7 bottom Accuracy: On-board product temperature monitoring Temperature: 350°C Setpoints Processes: Sn-Pb Reflow, Pb-Free Reflow, Solder Sphere Attach, Conductive Epoxy, Encapsulant Curing   Reflow Oven Model:Conceptronic Discovery Mark III Board size: 350mm Zones: 5 Zones, additional rapid cooling fans, thermal profiling Accuracy: 20°C Transport: edge conveyor, flat belt   Stencil Printers Model: Fuji GSP II Board size: 450mm x 350mm Accuracy: 25 microns Model: EKRA X4 Inline Screen Printer Board size: 450mm x 350mm Accuracy: 25 microns Stencil inspection Paste inspection Self cleaning Laser guided pin standoffs, double sided PCB Self adjusting rails to board width Auto programming of precise paste height   Board Washing Model: Hollis Holli Clean Board size: 350mm Cycles: pre wash, wash, rinse, hot air blow dry, low temp bake Auto fill: wash, rinse automatic fill Transport: flat belt Solvent: International products corp. LF2100 low foam detergent   Wave Board size: 450mm x 350mm Single action process Foam fluxer Rolling solder pot Adjustable temperature and solder flow Adjustable conveyor speed Pre-heat zone     Abenex also has various prototyping equipment for proto/initial run purposes.